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Product Name
Hi3921SRNIV100 PLC-IoT Module 3121N-ISC
Hi3921SRNIV100
0.5-5.7MHz
UART/GPIO/PWM/I2C/ADC
MCU: Cortex M3, 200MHz
20.0x14.2mm
Details Information
Introduction
3121N-ISC is a fully integrated power carrier (PLC) communication module with ultra-miniature size, compact structure and simple wiring. It can be widely used in intelligent street light, intelligent home, intelligent parking, central air conditioning and widely used in power Internet of things terminal equipment and other PLC instant communication application scenarios.
The 3121N-ISC is based on the HiSilicon Hi3921SV100 chipset, which integrates a high-speed/low-speed multi-mode power line carrier communication modem and an ARM Cortex-M3 processor. The Hi3921SV100 chipset supports P1901.1 and supports OFDM/FSK modulation.
3121N-ISC provides rich peripheral interfaces such as UART, PWM, GPIO, I2C, ADC, etc., and integrates the built-in Line-Driver. Equipped with Huawei IoT open source operating system LiteOS, it provides a more open development environment and a faster and safer operating system.
Features
CPU and Storage Performance
High-performance Cortex-M3 processor, working frequency 200MHz.
Embedded SRAM 256KB.
Physical Layer Features
Realize a subset of the IEEE 1901.1 standard. For chips that also use this subset, they can achieve interconnection and interoperability.
Supports two frequency bands of 0.5-3.7MHZ and 2.5-5.7MHZ. The frequency bands can be configured by software.
Adopt OFDM technology; support BPSK, QPSK modulation mode.
Support FEC and CRC functions, powerful denoising and error correction capabilities.
MAC Features
Support TDMA and CSMA/CA, and provide conflict avoidance mechanism.
Support data segmentation and reorganization to improve transmission efficiency.
Support data retransmission mechanism.
Support 4-level QoS to meet different business service quality requirements.
Networking Features
Supports automatic and fast networking, typical 200-scale, 2-level network scenarios, complete fast networking in 10s, and support fast communication.
Support dynamic routing, multi-path addressing.
Peripheral interfaces
I2C interface, UART interface, GPIO interface, PWM output, ADC input.
Communication indicators
The peak rate of the physical layer is 0.507Mbit/s, and the rate of the application layer is 80Kbps.
The receiving sensitivity is better than 0.2mVpp.
Power consumption and others
Static power consumption ≤0.15W (networking does not send packets).
Dynamic operating power ≤0.7W.
Operating temperature range: -40°C to +85°C.
Storage temperature range: -40°C to 125°C.
Package size: LxWxH:20.00*14.20*2.10mm.
Applications
LED Driver/Panel
Block Diagram
Parameters
| Model No. | 3121N-ISC | Main Chipset | Hi3921SRNIV100 |
| Interface | UART/GPIO/PWM/I2C/ADC | Band Standard | 0.5-5.7MHz |
| Data Rate | 80Kbps | Certification | RoHS,REACH |
| Antenna | L,N | Operating Voltage | 3.3V |
| Dimension | L20.0 * W14.2 * T2.10mm | MCU | Cortex M3, 200MHz |
| Operating Temperature | -40°C to 85°C | Storage Temperature | -40°C to 125°C |
Ordering Information
| Part No. | Description |
| FG3121NISC-01 | Hi3921SRNIV100,PLC SOC,20.0*14.2*2.1mm,Gold Finger Version,PCB V3.0 |
Product Name
Hi3921SRNIV100 PLC-IoT Module 3121N-ISC
Hi3921SRNIV100
0.5-5.7MHz
UART/GPIO/PWM/I2C/ADC
MCU: Cortex M3, 200MHz
20.0x14.2mm
Details Information
Introduction
3121N-ISC is a fully integrated power carrier (PLC) communication module with ultra-miniature size, compact structure and simple wiring. It can be widely used in intelligent street light, intelligent home, intelligent parking, central air conditioning and widely used in power Internet of things terminal equipment and other PLC instant communication application scenarios.
The 3121N-ISC is based on the HiSilicon Hi3921SV100 chipset, which integrates a high-speed/low-speed multi-mode power line carrier communication modem and an ARM Cortex-M3 processor. The Hi3921SV100 chipset supports P1901.1 and supports OFDM/FSK modulation.
3121N-ISC provides rich peripheral interfaces such as UART, PWM, GPIO, I2C, ADC, etc., and integrates the built-in Line-Driver. Equipped with Huawei IoT open source operating system LiteOS, it provides a more open development environment and a faster and safer operating system.
Features
CPU and Storage Performance
High-performance Cortex-M3 processor, working frequency 200MHz.
Embedded SRAM 256KB.
Physical Layer Features
Realize a subset of the IEEE 1901.1 standard. For chips that also use this subset, they can achieve interconnection and interoperability.
Supports two frequency bands of 0.5-3.7MHZ and 2.5-5.7MHZ. The frequency bands can be configured by software.
Adopt OFDM technology; support BPSK, QPSK modulation mode.
Support FEC and CRC functions, powerful denoising and error correction capabilities.
MAC Features
Support TDMA and CSMA/CA, and provide conflict avoidance mechanism.
Support data segmentation and reorganization to improve transmission efficiency.
Support data retransmission mechanism.
Support 4-level QoS to meet different business service quality requirements.
Networking Features
Supports automatic and fast networking, typical 200-scale, 2-level network scenarios, complete fast networking in 10s, and support fast communication.
Support dynamic routing, multi-path addressing.
Peripheral interfaces
I2C interface, UART interface, GPIO interface, PWM output, ADC input.
Communication indicators
The peak rate of the physical layer is 0.507Mbit/s, and the rate of the application layer is 80Kbps.
The receiving sensitivity is better than 0.2mVpp.
Power consumption and others
Static power consumption ≤0.15W (networking does not send packets).
Dynamic operating power ≤0.7W.
Operating temperature range: -40°C to +85°C.
Storage temperature range: -40°C to 125°C.
Package size: LxWxH:20.00*14.20*2.10mm.
Applications
LED Driver/Panel
Block Diagram
Parameters
| Model No. | 3121N-ISC | Main Chipset | Hi3921SRNIV100 |
| Interface | UART/GPIO/PWM/I2C/ADC | Band Standard | 0.5-5.7MHz |
| Data Rate | 80Kbps | Certification | RoHS,REACH |
| Antenna | L,N | Operating Voltage | 3.3V |
| Dimension | L20.0 * W14.2 * T2.10mm | MCU | Cortex M3, 200MHz |
| Operating Temperature | -40°C to 85°C | Storage Temperature | -40°C to 125°C |
Ordering Information
| Part No. | Description |
| FG3121NISC-01 | Hi3921SRNIV100,PLC SOC,20.0*14.2*2.1mm,Gold Finger Version,PCB V3.0 |
