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V200Z-R AIoT Module

BES2600WM BT5.2
802.11a/b/g/n 
On-chip RAM & Flash
28x20mm 1T1R
Availability:
  • 2.4G 
  • BT5.0 and above 
  • Bestechnic 
  • 1T1R 
  • Select 
  • Wi-Fi&BT Interface 

Product Name

BES2600WM  AIoT Module V200Z-R  

Chipset: BES2600WM

802.11a/b/g/n

BT 5.2  1T1R

On-chip RAM & Flash

28x20mm


Details Information

Introduction

V200Z-R is a highly integrated wireless module with voice & audio functions. It is based on BES2600 solution which features a Cortex-M33 Star dual-core MCU subsystem and a Cortex-A7 dual-core AP subsystem. Both MCU and AP subsystem are able to run RTOS and user applications.

The module supports low power Wi-Fi 4 (1x1 802.11a/b/g/n dual-band) and Bluetooth 5.2 dual-mode (support BT/BLE, LE Audio). Besides, it provides a high-performance on-board printing antenna to reduce the complexity of hardware design.

V200Z-R also provides a voice & audio CODEC subsystem and a display subsystem with 2D graphics engine. It supports MIPI DSI HD display up to HD (720P60), supports MIPI CSI Camera up to 2MPixel, and supports microphone arrays with up to three analog microphones or six digital microphones for far-field voice application. MCU subsystem runs Bluetooth upper protocol stack, and AP subsystem and 2D hardware Graphics Engine can accelerate GUI & VUI, voice & audio processing and AI tasks. 

This compact module is a perfect choice for smart appliance, smart panel, entrance guard and other smart home applications.


Features

This is a high-performance, multi-functional, cost-effective AIoT SoC and Multi-Modal V200Z-R Development Board.


CPU 

CMOS single-chip fully-integrated PMU, CODEC, RF, BB, MCU and AP subsystem. 

300MHz ARM Cortex-M33 Star dual-core MCU subsystem. 

1GHz ARM Cortex-A7 dual-core AP subsystem with NEON. 

Shared 2MB SRAM, on-chip PSRAM and on-chip NOR flashNote1. 

Support TrustZone and secure boot. 

Wi-Fi / BT

2.4GHz & 5GHz dual-band Wi-Fi, 1T1R, compliant to IEEE 802.11a/b/g/n. 

Support 20MHz and 40MHz bandwidth. 

Bluetooth 5.2 dual-mode. 

Support BLE Mesh and LE audio.

A2DP v1.3/AVRCP v1.5/HFP v1.6. 

Wi-Fi and Bluetooth co-existence.

Audio

Hi-Fi Stereo Audio DAC and ADC. 

Far-field voice wake up. 

24bit audio processing. 

Support Acoustic Echo Cancellation. 

Support DSD-64/128/256 decode.

Peripheral interfaces

MIPI Tx DSI and MIPI Rx CSI interface 

USB2.0 HS Host or Device 

4x UART interface, with flow control and configurable baud rate 

50Mbps SPIx2, with serial LCD support 

1.4Mbps I2C master x3 

I2S/TDM 

PWMx8 

10-bit GPADC, 3 channels


Note1: Please refer to ordering information for detailed memory size.


Block Diagram

V200Z-R module

Parameters

Model No. V200Z-R Main Chipset BES2600
Interface USB2.0, UART, I2C, I2S, SDIO device, MIPI, PWM, GPIO Wi-Fi Standard IEEE 802.11a/b/g/n
RF Antenna On-board antenna / IPEX  OS Supported RTOS, OpenHarmony
Operating Frequency

2.4G: 2.400~2.4835GHz 5G: 5.18GHz ~ 5.825GHz

Operating Voltage 1.8V
Dimension L x W x H: 28 x 20 x2.55 mm RF Chain 1T1R
Operating Temperature -20°C to 80°C Storage Temperature -30°C to 125°C


Ordering Information

Part No. Description
FGV200ZRXX-00 BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 16MB PSRAM and 16MB Flash, 28X20mm, with shielding, printing antenna
FGV200ZRXX-01 BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 40MB PSRAM and 32MB Flash, 28X20mm, with shielding, printing antenna





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CONTACT INFORMATION

 14th Floor, Block B, Phoenix Zhigu, No.50 Tiezai Road, Gongle Community, Xixiang Street,
Baoan District, Shenzhen, China 518000

 davidchen@fn-link.com

 +86-755-2332 9312

FN-LINK TECHNOLOGY LIMITED is mainly engaged in the R&D, production and sales of wireless communication modules and system solutions, peripheral equipment, and audio-visual equipment

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