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D232B-WB Wi-Fi 6 Dongle

RTL8832BU  11ax
2T2R   USB dongle
17.9*150*11.2mm
 
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Product Name

RTL8832BU  Dongle  D232B-WB

Chipset: RTL8832BU

802.11a/b/g/n/ac/ax

2T2R   USB

17.9X150X11.2mm


Details Information

Introduction

The D232B-WB is an 802.11 a/b/g/n/ac/ax wifi MIMO USB3.0 dongle . The dongle is a highly integrated  single-chip that support 2-stream 802.11ax solutions with Multi-user MIMO (Multiple-Input, Multiple-Output)  with Wireless LAN (WLAN) USB network interface controller. It combines a WLAN MAC, a 2T2R capable  WLAN baseband, and RF in a single chip. The D232B-WB provides a complete solution for a high-performance wireless device. 

The Dongle is specifically developed for Portable devices.


Features

General Features 

Support 802.11ac 2x2,Wave-2 compliant with RX MU-MIMO. 

Backward compatible with 802.11a/n/ac devices while operating at 802.11ax data rates. 

IEEE 802.11a/b/g/n/ac/ax compatible WLAN. 

IEEE 802.11i (WPA, WPA2, WPA3). Open, shared key, and pair-wise key authentication services. 

IEEE 802.11ax MIMO OFDM/OFDMA,IEEE 802.11ac MIMO OFDM,IEEE 802.11n MIMO OFDM. 

CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11a/b/g/n/ac/ax compatible  WLAN. 

Maximum PHY data rate up to 286.8 Mbps using 20MHz bandwidth, 573.5Mbps using 40MHz  bandwidth, and 1201Mbps using 80MHz bandwidth. 

WLAN Interface 

Complies with USB2.0 for WLAN.


Block Diagram

D232B-WB dongle


Parameters

Model No. D232B-WB Main Chipset RTL8832BU
Wi-Fi Interface Support USB2.0 Wi-Fi Standard IEEE 802.11a/b/g/n/ac/ax
Transmission rate

2.4GHz:574Mbps

5GHz:1201Mbps

Antenna type Extemal Antenna
Operating Voltage 5V RF Chain 2T2R
Dimension LxWxH:17.9x150x11.2 mm Operating Temperature 0°C to 70°C
Storage Temperature -40°C to 85°C Security WPA,WPA2,WPA3


Ordering Information

Part No. Description
FGD232BWBX-00 RTL8832BU,a/b/g/n/ac/ax,2T2R,22.95*14.8mm,USB




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CONTACT INFORMATION

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Baoan District, Shenzhen, China 518000

 davidchen@fn-link.com

 +86-755-2332 9312

FN-LINK TECHNOLOGY LIMITED is mainly engaged in the R&D, production and sales of wireless communication modules and system solutions, peripheral equipment, and audio-visual equipment

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